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Computational Mechanics of Particle-Functionalized Fluid and Solid Materials for Additive Manufacturing and 3D Printing Processes

UC Berkeley, Sibley Auditorium, Bechtel Engineering Center,  May 30-31, 2017 
Organizers: Tarek I. Zohdi (UC Berkeley) and Eric Shaqfeh (Stanford) 
Sponsored by the National Academy of Sciences in conjunction with: 
The International Union of Theoretical and Applied Mechanics, The United States National Committee on Theoretical and Applied Mechanics, The Robert M. and Mary Haythornthwaite Foundation Mechanics is greatly appreciated and The Army High Performance Computing Research Center

Within the last decade, several industrialized countries have stressed the importance of advanced manufacturing to their economies. Many of these plans have highlighted the development of robust additive manufacturing techniques, such as 3D-printing, which are still in their infancy. The combination of rigorous material modeling and particle-laden rheological theories, coupled with the dramatic increase of computational power, opens up the possibility that scientific computing can play a significant role in the analysis, control, and design of many emerging additive manufacturing processes. However, for these goals to be realized, a deep understanding of the essential ingredients comprising the materials involved in additive manufacturing is needed. Particle-functionalized materials play a central role in this field, frequently in the form of:

   1.  heated filament comprised of particles in a binding matrix,

   2.  inks comprised of particles in a solvent/lubricant, which cure when deposited and

   3.  dry particles (powders) which are deposited onto a surface and then heated in very targeted areas

   4.  potentially by a laser or other external source, in order to fuse them into place.

The role of these processes is primarily to build surface structures, coatings, etc., which are extremely difficult to construct using classical manufacturing methods.  

For more information about the workshop see: